Precision Flexible Circuit Fabrication: Technology & Value Drivers

1. Cutting-Edge Manufacturing Methodology

Substrate Engineering: High-performance polyimide (PI, Tg > 250°C) or PET films with 12–125μm thickness options, featuring ≤2% dimensional stability at 150°C.

Laser Microvia Formation: CO₂/UV laser systems achieve 25–50μm diameter vias with ±3μm registration accuracy, supporting 20μm stacked microvia structures.

Advanced Metallization: Sequential build-up with modified semi-additive process (mSAP) enables 18±2μm copper traces at 50μm pitch.

Encapsulation Technology: Liquid crystal polymer (LCP) coverlays or photo-definable dielectric coatings provide >500MΩ insulation resistance after 1000 thermal cycles (-55°C to +125°C).

2. Performance Differentiation

Mechanical Reliability: Sustains 200,000+ dynamic flex cycles at 0.5mm bend radius (IPC-6013D Section 3.11 compliant).

High-Frequency Capability: Dk=3.2±0.05 @10GHz with ≤0.003 dissipation factor for 5G mmWave applications.

Miniaturization: Enables 0.2mm pitch chip-on-flex (COF) mounting through 10μm line width capability.

Environmental Compliance: Halogen-free materials meet IEC 61249-2-21 standards with 94V-0 flammability rating.

3. Smart Manufacturing Integration

Industry 4.0 Infrastructure:

In-line 3D AOI with 5μm resolution for 100% layer-to-layer alignment verification

AI-driven yield prediction system reducing scrap rate to <0.8%

Roll-to-roll (R2R) processing achieving 95% material utilization for high-volume orders